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MITSUBISHI SEMICONDUCTOR < Dual-In-Line Package Intelligent Power Module>
PS21A79
TRANSFER-MOLD TYPE
INSULATED TYPE
Fig. 7 AN EXAMPLE OF APPLICATION CIRCUIT
R3
C5
U P (1)
V P1 (3)
IGBT1
Di1
P(40)
C2
HVIC
D2
+
V UFB (4)
V UFS (6)
U(39)
C1 D1 C2
R3
C5
C2
V P (7)
V P1 (9)
HVIC
IGBT2
Di2
D2
+
C1 D1 C2
R3
C5
C2
V VFB (10)
V VFS (12)
W P (13)
V P1 (14)
V PC (15)
HVIC
IGBT3
Di3
V(38)
M
D2
+
C1 D1 C2
V WFB (16)
V WFS (18)
IGBT4
Di4
W(37)
+
R3
U N (27)
C3
R3
C5
V N (28)
NU(36)
C5
R3
C5
W N (29)
IGBT5
Di5
5V
C FO (25)
NV(35)
R2
Fo(26)
LVIC
IGBT6
Di6
V OT (23)
15V
NW(34)
V D
C1
+
D1
C2
V N1 (21)
V NC (22)
V NO
C
CIN(24)
B
V SC (19)
D
Note
C4
R1
Rs Sense
resistor
A
N1
1 :If control GND is connected to power GND by broad pattern, it may cause malfunction by power GND fluctuation. It is recommended to connect control GND
and power GND at only a point at which NU, NV, NW are connected to power GND line.
2 :To prevent surge destruction, the wiring between the smoothing capacitor and the P,N1 terminals should be as short as possible. Generally inserting a
0.1 μ ~0.22 μ F snubber capacitor C3 between the P-N1 terminals is recommended.
3 :The time constant R1C4 of RC filter for preventing protection circuit malfunction should be selected in the range of 1.5 μ s~2 μ s. SC interrupting time might vary
with the wiring pattern. Tight tolerance, temp-compensated type is recommended for R1,C4. When R1 is too small, it will leads to delay of protection. So R1
should be min. 10 times larger resistance than Rs. (Over 100 times is recommended.)
4 :All capacitors should be mounted as close to the terminals of the DIPIPM as possible. (C1: good temperature, frequency characteristic electrolytic type, and
C2: 0.22 μ ~2.0 μ F, good temperature, frequency and DC bias characteristic ceramic type are recommended.)
5 :It is recommended to insert a Zener diode D1 (24V/1W) between each pair of control supply terminals to prevent surge destruction.
6 :To prevent erroneous SC protection, the wiring from V SC terminal to CIN filter should be divided at the point D that is close to the terminal of sense resistor.
And the wiring should be patterned as short as possible.
7 :For sense resistor, the variation within 1%(including temperature characteristics), low inductance type is recommended. And the over 1/8W is recommended,
but it is necessary to evaluate in your real system finally.
8 :To prevent erroneous operation, the wiring of A, B, C should be as short as possible.
9 :Fo output is open drain type. It should be pulled up to the positive side of 5V or 15V power supply with the resistor that limits Fo sink current I Fo under 1mA. In
the case pull up to 5V supply, over R2=5.1k ? is needed. (10k ? ? is recommended.)
10 :Error signal output width (t Fo ) can be set by the capacitor connected to C FO terminal. C FO (typ.) = t Fo x (9.1 x 10 -6 ) (F)
11 :High voltage (V RRM =600V or more) and fast recovery type (trr=less than 100ns or less) diode D2 should be used in the bootstrap circuit.
12 :If high frequency noise superimposed to the control supply line, IC malfunction might happen and cause erroneous operation. To avoid such problem, voltage
ripple of control supply line should meet dV/dt ≤ +/-1V/ μ s, Vripple ≤ 2Vp-p.
13 :Input drive is High-Active type. There is a 3.3k Ω (min.) pull-down resistor integrated in the IC input circuit. To prevent malfunction, the wiring of each input
should be patterned as short as possible. When using RC filter R3C5, it is necessary to confirm the input signal level to meet the turn-on and turn-off threshold
voltage. Thanks to HVIC inside the module, direct coupling to MCU without any opto-coupler or transformer isolation is possible.
8
March 2011
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